Exhibitor's Forum and Expert Panels

Tuesday, 11.03.2025, Exhibitor's Forum Hall 5 / Booth 5-210, 11:30 - 12:30

Are SoC Vendors Providing the Right Tools for Edge AI Developers?

This panel features invited SoC vendor and ecosystem representatives to discuss their solutions for hardware and software for AI at the Edge. In this space, hardware offerings range from discrete SoCs and SoMs, to complete Edge AI-targeted IPC platforms. Software offerings provided by SoC vendors and software suppliers range from API support for NN/NPU hardware, to complete solutions for AI training and on-device inference. George Grey, founder of Foundries.io, hosts a panel to find out whether Edge AI developers are getting the tools they need. Panel attendees will find out more about key applications for AI at the Edge, what tools are available from vendors to build Edge AI solutions, developer workflow for AI applications, how to compare vendor solutions and tools, and speakers views on the future of AI and Edge computing.

Moderation:

George Grey, Foundries.io lead at Qualcomm

Speaker:

• Manvinder Singh, Vice President Product Management, Qualcomm
• Zach Shelby, Chief Executive Officer (CEO), Edge Impulse
• Nicolas Gaude, AI Solutions Product Marketing Manager, STMicroelectronics
• Ali Osman Ors, Global Director AI Strategy and Technologies, NXP Semiconductors

Tuesday, 11.03.2025, Conference Area NCC East / Room Sydney, 13:30 - 14:30

c-level@embedded-world

embedded world Exhibition&Conference is the world’s largest event on the topic as well as the meeting point for the global community, from deeply technical developers to industry leaders. In the expert panel “c-level@embedded-world”, we will have top-level managers from leading companies discussing general trends, overarching challenges and looming opportunities of the embedded world. Join us for an intense discussion with today’s thought leaders!

Prof. Dr.-Ing. Axel Sikora, Offenburg University and Hahn-Schickard Association, Germany / Chairman of the embedded world Conference

Speaker:

• Deepali Trehan, Head of Product Marketing, Altera, an Intel Company
• Dr. Ahmad Bahai, Chief Technology Officer (CTO) and Director of Kilby Labs, Texas Instruments
• Remi EL-OUAZZANE, President, Microcontrollers, Digital ICs and RF products Group, STMicroelectronics

Wednesday, 12.03.2025, Exhibitor's Forum Hall 5 / Booth 5-210, 11:30 - 12:30

Implementing the Cyber Resilience Act (CRA)

The Cyber Resilience Act (CRA), as a significant legislative milestone of the European Commission, has the potential to heavily influence embedded systems development. Aiming at enhancing the cybersecurity and resilience of products with digital elements, it forces manufacturers and developers to ensure, that their products are secure by design and that vulnerabilities can be addressed throughout the complete product lifecycle. Besides these technical challenges, liability requirements will force the implementation of new processes that ensure transparent updates will be implemented within short time periods. From this panel, the audience will learn how this new framework for cybersecurity can and must be implemented into their products and development processes. Key questions which will be addressed include: What is the content of the CRA? How will it affect companies’ processes? What does this imply for IoT and other embedded products? What must be considered from an architectural perspective for the hardware and software implementation? What (open source) solutions are available and will help companies to comply with the CRA?

Moderation:

Prof. Dirk Pesch, ewC Steering Committee, University College Cork, Ireland

Speaker:

• Dr. Julien Bernet, Head of Security, Witekio
• Mark Hermeling, VP of Global Solutions Engineering, CodeSecure
• Caren Kresse, Member of the Board of Directors, OSADL

Wednesday, 12.03.2025, Conference Area NCC East / Room Sydney, 13:30 - 14:30

IoT Security: a Holistic Approach to Securing the IoT Stack

Most IoT regulations, standards, and certifications today concentrate on securing devices against attack. But what good is a secure device if the cloud/app or network layers behind it are insecure? This panel will discuss what is required to provide the greatest level of security to IoT deployments by analyzing all layers of the IoT stack. It will also update attendees on the latest security initiative from the IoT M2M Council and Global Certification Forum – the IMC-GCF Joint Task Force on IoT Security – which takes this holistic approach to cybersecurity.

Moderation:

Robin Duke-Wooley, CEO/Principal, Beecham Research

Speaker:

• Patrick Cao, VP of RSP/SIM/eSIM Products, Tata Communications
• Syed Hosain, Founder/Evangelist, Aeris
• Markus Soppa, Managing Director, filancore
• Mike Rohrmoser, VP Product Management OEM Solutions, Digi International
• Jean-Francois Gros, Head of IoT Services Product Lines, Thales

Thursday, 13.03.2025, Exhibitor's Forum Hall 5 / Booth 5-210, 11:30 - 12:30 
Hardware Accelerators for AI – Impact on Embedded Vision

The race to unlock AI's full potential is reshaping the embedded vision landscape, with hardware accelerators at the forefront. From edge devices to autonomous systems, these specialized chips are enabling faster processing, reduced power consumption, and real-time capabilities. AI accelerators promise to push the boundaries of what's possible with AI-driven embedded vision. But as innovation accelerates, so do the challenges of integration, optimization, and scalability. What does this mean for the future of embedded vision? How will these advancements shape industries relying on vision systems, from automotive to healthcare, from retail to logistics, and: will existing edge applications in the machinery and production industry benefit? Join experts from the embedded vision and AI industry as they delve into the transformative impact of hardware accelerators on embedded vision and discuss the breakthroughs, obstacles, and opportunities that lie ahead.

Moderation:

David Löh, Editor-in-Chief, inspect, Wiley-VCH

Speaker:

• Dr. Jean Caron, Vice President Sales & Support EMEA, euresys (a TKH Vision brand)
• Yash Kharia, Director Product Management, Industrial Embedded IoT Business, Qualcomm Technologies
• Dr. Martin Klenke, Director Business Development, Teledyne Imaging
• Jan-Erik Schmitt, Vice President, Vision Components
• Jan-Friso Blaquière, Vice President Sales, Hailo

Thursday, 13.03.2025, Conference Area NCC East / Room Sydney, 13:30 - 14:30
The Future of Cloud Enabled Development of Software Defined Vehicles

The convergence of Software Defined Vehicles (SDVs) and Virtual Prototyping, powered by cloud technologies, is revolutionizing the automotive industry by accelerating development cycles, improving quality, and enhancing safety compliance. Cloud-based platforms enable shift-left and shift-right testing, allowing earlier validation and ongoing optimization throughout a vehicle’s lifecycle. Virtual prototyping allows engineers to simulate complex systems without physical tests, cutting time-to-market and costs. SDVs add flexibility with over-the-air updates and real-time monitoring, ensuring compliance with evolving safety, security, and performance standards. Cloud tools support the full development pipeline, fostering a continuous feedback loop that enhances innovation and reliability in next-generation vehicles. The panelists give an insight in the state of the art of cloud based SDV and virtual prototyping from the point of view of cloud service providers, virtual platform providers, IoT/SDV developers and IT services.

Moderation:

Kanishk Agrawal, CTO, Judge Group

Speaker:

• Nicholas Glewicz, Vice President, Judge Group
• Bill Neifert, Vice President, Corellium
• Christopher Rumpf, Senior Director Automotive & IoT, ARM
• Prof. Dr. Dirk Slama, Robert Bosch