Cooling solutions for embedded systems and IPCs

The right cooling solution for every system

Ideally, embedded systems are cooled directly at the hot spot. The type of cooling solution depends on the degree of power loss and the available installation space.

We can implement the following heat sink solutions for your embedded system or IPC:

-Heat spreader solutions with integrated heat pipes that conduct the heat from the hot spot to the heat sink

-Copper inlay heat sinks for direct installation at the hot spot

-Cold extruded pin block heat sinks with a special pin and fin design that enables higher air flow rates than standard extruded heat sinks

-Soldered finger, clip-on or mini screw-on PCB heat sinks for all standard semiconductor housings

-Factory-mounted fan units and ready-to-install sets consisting of a heat sink and mounting accessories