EIC77 Series SoC

The ESWIN EIC77 Series (EIC7700X Single-die SoC, EIC7702X Dual-die SoC) is the collection of excellent SoCs specialized in multi-purpose AI, the currently most powerful 64-bit RISC-V high-performance Quad-Core Complex(CPU) and self-developed highly efficient AI processor(NPU) are the heart of the product, CPU core frequency is running at 1.4GHz, up to 1.8GHz.

Essentially, the EIC7702X SoC consists of x2 EIC7700X SoCs being connected through 8-lane 112Gbps Serdes with cache coherency, thus the overall performance of dual-die is boosted up to double compared to single-die, the total AI computation is increased to 40TOPS in INT8, and it is supporting full-stack floating-point in FP16. In addition to the high computation, the integrated high speed LPDDR5 memory controller makes the SoC have the memory bandwidth of up to 102 GByte and the capacity of up to 64 GByte, therefore the product is highly suitable for running large language models(LLMs) and can be widely applied in various AI scenarios including but not limited to gaming, offices, education, and multimedia.

Additional key features in the ESWIN SoCs include the 2D and 3D GPUs, computer vision DSPs, the TEE-based security subsystems, and audio and video processing units. The capability of video encoding is up to 8K@50fps or 26-channel 1080p@30fps and the capability of video decoding is up to 8K@100fps or 64-channel 1080p@30fps. Multiple Built-in ISPs connect up to x2 image sensors of 33MP(million pixels) or up to x8 image sensors of 2MP(million pixels)

Besides, the SoC has rich peripherals, such as 16-lane MIPI CSI C/D PHY and LVDS/HiSPi, x2 4-lane MIPI DSI, x2 HDMI, x2 eMMC, x2 SATA, x2 SDIO(x1 for SD card, x1 for SDIO WiFi), x4 USB3.0(DRD), x6 SPI, x4 GMAC, x2 PCIe(RC+EP), x24 I2C, x10 UART, x6 I2S, GPIOs, etc. (The number mentioned above is the maximum number of interfaces the series of the product can support.)