GUC is a market leader in advanced ASIC services. We offer comprehensive solutions that cover every aspect of professional ASIC design, including front-end and spec-in design, SoC (System-on-Chip) integration, physical implementation, verification, and turnkey manufacturing. Additionally, we provide cutting-edge design and manufacturing services for TSMC’s advanced packaging technologies, such as CoWoS, InFO, SoIC, and SoW (System-on-Wafer). Our industry-recognized IPs for HBM (High-Bandwidth Memory), die-to-die, and die-on-die interconnects further strengthen our portfolio.GUC is a leader in the ASIC service across key segments, including AI, HPC (High-Performance Computing), Automotive, 5G/Networking, SSD (Solid-State Drive), and Industrial applications. We are committed to delivering highly competitive ASIC solutions with optimized PPA (Power, Performance, and Area), superior product quality, high yield, and accelerated time-to-market. Our dedication to engineering excellence sets us apart in an increasingly competitive landscape.Taiwan Semiconductor Manufacturing Co. (TSMC) is GUC’s largest shareholder, holding 35% of the company’s total shares. TSMC is also our sole foundry partner and closest collaborator in advanced process and packaging technologies. This strong partnership enables us to overcome design and manufacturing challenges, driving excellence in every product we deliver. Headquartered in Hsinchu, Taiwan, GUC has a global presence with offices in North America, Mainland China, Europe, Korea, Japan, and Vietnam. GUC is publicly traded on the Taiwan Stock Exchange (TWSE: 3443).