embedded world | DDR4 High Density Components & Modules

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DDR4 High Density Components & Modules

Logo Intelligent Memory EMEA GmbH

by Intelligent Memory EMEA GmbH

Key Facts

  • Components' Key Features -DDR4 Densities: 4Gb, 8Gb, 16Gb, & 32Gb --x4 and x8 data widths in a 78-ball FBGA package --x16 data width in a 96-ball FBGA package -x4 available for high-density solutions -Clock speeds of up to 1600MHz (3200Mbps) for high bandwidth performance -1.2V (VDD, VDDQ), and 2.5V VPP -Industrial temperature grades available
  • Modules' Key Features -Form Factors: -Non-ECC UDIMM, ECC UDIMM, non-ECC SODIMM, ECC SODIMM, RDIMM, Mini-RDIMM & ECC Mini-UDIMM -Higher bandwidth performance (up to PC4-25600) -Capacities: 2GB to 64GB -PCB Height: Standard, VLP & ULP

Categories

  • Hardware Modules for Secure Embedded Systems
  • SRAM/DRAM Memory Modules
  • Memory ICs
Product Picture DDR4 High Density Components & Modules
Product Picture DDR4 High Density Components & Modules
Product Picture DDR4 High Density Components & Modules
Product Picture DDR4 High Density Components & Modules
Product Picture DDR4 High Density Components & Modules
Product Picture DDR4 High Density Components & Modules

Key Facts

  • Components' Key Features -DDR4 Densities: 4Gb, 8Gb, 16Gb, & 32Gb --x4 and x8 data widths in a 78-ball FBGA package --x16 data width in a 96-ball FBGA package -x4 available for high-density solutions -Clock speeds of up to 1600MHz (3200Mbps) for high bandwidth performance -1.2V (VDD, VDDQ), and 2.5V VPP -Industrial temperature grades available
  • Modules' Key Features -Form Factors: -Non-ECC UDIMM, ECC UDIMM, non-ECC SODIMM, ECC SODIMM, RDIMM, Mini-RDIMM & ECC Mini-UDIMM -Higher bandwidth performance (up to PC4-25600) -Capacities: 2GB to 64GB -PCB Height: Standard, VLP & ULP

Categories

  • Hardware Modules for Secure Embedded Systems
  • SRAM/DRAM Memory Modules
  • Memory ICs
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Product information

Components:

IM has recently expanded its high-density DDR4 portfolio with the launch of 32Gb DRAM components. Available in both commercial and industrial temperature ranges, these components are designed for demanding applications. The DDR4 32Gb offers x16 (1CS) and x8 (2CS) configurations, delivering exceptional reliability and longevity support.

A real gem in our portfolio is our new 16Gb DDR4 x4 component which is ideal for high density DRAM modules. These new components are qualified for extended temperatures of -40°C to +95°C. Furthermore, these components allow for advanced ECC (error correcting code) techniques in memory modules that are needed in high-reliability environments

Modules:

IM is one of the few memory manufacturers to offer both DRAM components and DRAM modules, in addition to customizable NAND flash memory. Consequently, we have also recently released two new DDR4 memory modules with a x4 organization based on our new components for operating temperatures ranging from -40 to +95C: The IM 32GB DDR4 VLP RDIMM in 1 rank, and the IM 64GB DDR4 RDIMM in 2 ranks.

True to our commitment to industrial and specialty applications, both the components and modules are only available in commercial temperature ranges, whereas IM provides them in both commercial and industrial grades, setting us apart. With our x4 DDR4 DRAM range, we provide more choice and options for today’s data-intensive specialty applications like data loggers, for example.

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