embedded award 2023: Embedded vision nominees

A one megapixel time-of-flight module, a ultra-compact 3D laser profile sensor and a miniature near-eye display module

ADTF3175 – One Megapixel Time-of-Flight Module

Exhibitor: Analog Devices
Hall/Booth: 4A/4A-360

Across many industries automation is becoming a necessity as the available workforce resources diminish and onshoring on manufacturing and logistics increases. Autonomous Automation requires a combination of advanced sensor technology and post processing (machine learning / AI) in order to become a reality and address this global surge in demand for automation.

The ADTF3175 Time-of-Flight Depth Sensor advances the accuracy and quality of depth imaging such that autonomous machines can operate more efficiently and at a faster rate. For instance, as machines transition to autonomous modes of operation where they take on more and more of the decision-making process, their need to perceive accurately with precision in three dimensions advances.

Today, depth sensing is accomplished using triangulation methods (i.e. stereo 2D cameras or structured light) but this has a number of limitations as compared with accessing true 3D depth measurements. The ADTF3175 is able to resolve 3D images with an accuracy of +/-3mm over the full depth range of 20cm up to approx 4m.

Another example is with Autonomous mobile robots (AMR) that require the ability to see all around them, and to navigate safely in environments that will contain obstacles, and that will have a wide range of illumination conditions. Collaborative robots (cobots) must work alongside humans, and safety is paramount; safety that can only come with accurate, low-latency imaging of the shared space that the ADTF3175 enables.

The ADTF3175 is the first high-resolution, industrial quality, indirect Time-of-Flight (ToF) module for 3D depth sensing and vision systems. The module delivers a turnkey, scalable system that provides high-accuracy and robustness over variable environmental conditions.

Moreover, the module abstracts the burden of optical and electromechanical system design and delivers a fully engineered and calibrated depth system to designers allowing them to concentrate on bringing new 3D sensing and vision systems to the market.

Time-of-Flight technology is complex to implement for typical customers. It requires capabilities in optical, mechanical, and high-speed electrical design, combined with sophisticated system engineering expertise and supply-chain breadth around chip-on-board, optics, etc. The result of this complexity has limited the access to this groundbreaking technology.

Current high quality depth cameras that are custom engineered tend to be expensive. The goal of the ADTF3175 is to democratize the access to high-performance (ToF) to the broadest base of users while bringing to bear Analog Devices’ expertise and understanding of the industrial market with respect to technical challenges, quality, and product lifetime.

Based on the ADSD3100, a 1 Megapixel CMOS indirect Time-of-Flight (iToF) imager, the ADTF3175 also integrates an infrared illumination source with optics, laser and laser driver and a receive path with a lens and an optical band-pass filter.