embedded world | QSMP-25 Computer-On-Modules

Hall 4A / Booth Number 4A-321

QSMP-25 Computer-On-Modules

Logo KARO electronics GmbH

by KARO electronics GmbH

Key Facts

  • High long-term availability of over 10 years
  • Suitable for high volume quantities due to automated machine processing using standard production methods in the electronics industry
  • Suitable for tough industrial use with 24-hour availability over 10 years

Categories

  • Other Computer Modules
  • Embedded PCs
  • Computer Modules
  • System Boards
Product Picture QSMP-25 Computer-On-Modules
Product Picture QSMP-25 Computer-On-Modules

Key Facts

  • High long-term availability of over 10 years
  • Suitable for high volume quantities due to automated machine processing using standard production methods in the electronics industry
  • Suitable for tough industrial use with 24-hour availability over 10 years

Categories

  • Other Computer Modules
  • Embedded PCs
  • Computer Modules
  • System Boards
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Product information

The QSMP2 is a QFN Style Solder-Down Computer-On-Module. The module with a small square size of 29mm and a height of 2.6mm is single-sided assembled. Its QFN type lead style has a 1mm pitch with 108 pads. The ground pad additionally acts as thermal pad. The guaranteed long-term availability and the industry-rated design make them ideal for embedded computing solutions. Ka-Ro provides evaluation kits and ready-to-use mainline Linux to quickly start developing.

  • STM32MP255 processor
  • Dual ARM® Cortex®-A35 cores
  • 1.5 GHzARM® Cortex®-M33 core
  • 400 MHzVivante® NPU, 1.35 TOPS
  • 1 GB LPDDR4
  • 4 GB eMMC
  • temperature range -40°C to 85°C
  • LVDS Display Interface
  • 3D GPU: OpenGL® ES 3.1 - Vulkan 1.1, OpenCL™ 1.2, OpenVX™ 1.1, Up to 149 Mtriangle/s, 900 Mpixel/s
  • VPU: H264/VP8 up to FHD (1920×1080)@60 fps
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