embedded world | Racyics GmbH
Racyics GmbH auf der embedded world
Exhibitor

Hall 4 / Booth Number 4-573

Racyics GmbH

Service

Racyics® is Europe's leading design partner for mixed-signal System-on-Chip design in advanced nodes.

About us

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Floor plan

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Products

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Employees

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Articles

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Sessions

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We offer

  • PCB design
  • IC Design
  • Firmware and Driver Development
  • Semiconductor Manufacturing (Foundry Services)
  • Testing Services
  • Cloud Services
  • Consulting
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Industry

  • Automotive industry / electronics
  • Industrial controls
  • Telecommunication
  • Consumer electronics
  • Computers / PC peripherals
  • Medical engineering
  • Data communication / M2M
  • Security
  • Aerospace / military
  • Safety
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Contact Information

Bergstraße 56
01069 Dresden
Germany

About us

Racyics® is Europe's leading design partner for mixed-signal System-on-Chip design in advanced nodes. With Germany-wide locations in Dresden, Frankfurt/Main and Duisburg and counting over 140 employees, the company offers customers design services for analog, mixed-signal, and digital ICs including custom IP and turnkey ASIC solutions.

Having worked for leading semiconductor companies for many years, the Racyics team has contributed to more than 100 successful chip designs down to 3nm feature size for automotive, consumer and communication applications. As GlobalFoundries® channel partner with focus on advanced and leading-edge technologies, Racyics provides access to 28nm, 22nm and 12nm prototyping runs (MPWs).

Furthermore, Racyics offers with makeChip an unique design enablement service for Start-ups, SMEs and academia.

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Participant in the special area

  • IC&IP Design Area
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Floor plan

Products

Product Picture Racyics® ABX® Platform
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Racyics® ABX® Platform

Product Picture makeChip - A Cloud-based IC Design Environment
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makeChip - A Cloud-based IC Design Environment

Product Picture Racyics® ABX® Adaptive Body Bias Generator IP
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Racyics® ABX® Adaptive Body Bias Generator IP

Product Picture Racyics® IP Products
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Racyics® IP Products

Employees

Sebastian

Sebastian Höppner

Chief Product Officer

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Florian

Florian Bilstein

Director Design Service

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Patrick

Patrick Döll

Physical Design Engineer

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Articles

Sessions

Keywords

Design Service | FDSOI | Packaging | System-On-Chip SoC | Turnkey ASIC Service | IP