{{else if Image}}
{{else if Image}}
{{/if}}
{{/if}}
embedded award 2025: SoC/IC/IP design nominees
The design of integrated circuits (ICs), System-on-chip (SoC) and of circuits that are then integrated into ICs, the so-called intellectual property (IP), is a core discipline of embedded system development. This core discipline has now finally found its way into the embedded award as a category. Check out the nominees …
A solid-state active cooling solution for Edge AI, a monolithic UWB chipset and a small general-purpose MCU
AirJet®PAK
Exhibitor: Frore Systems
Hall/Booth: 5-141
The AirJet PAK, the world‘s first solid-state active cooling solution for Edge AI, leverages the revolutionary award winning AirJet chip. The AirJet PAK is a fully self-contained active heat sink module – simple to embed and completely eliminating the need for noisy fans or heavy bulky heatsinks.
Powerful Heat Removal - AirJet PAK 5C-Gen1 removes net 32 W of heat at a silent 29 dBA, while consuming a maximum of 6.5 W of power, outperforming fans in compact Edge AI devices.
The extremely compact AirJet PAK is only 100mm x 65mm, and the thickness varies from just 5.8mm to 9mm depending how much heat needs to be removed. It generates 1750 Pascals of back pressure, ensuring effective air flow into and out of the cartridge, even when the air vents are covered with IP54 dustproof and water-resistant filters. This, together with the AirJet PAKs intelligent self-cleaning capabilities, maximizes reliability and ensures the sustained thermal performance of the AirJet PAK and, as a result, the sustained high performance of the dustproof host device.
Unleashing AI Performance - Designed to work seamlessly with a wide range of AI SoM modules, like those from NVIDIA and Qualcomm, the AirJet PAK 5C-Gen1 is just 9 mm thick and unleashes over 150 trillion operations per second (150 TOPS). This ultra-slim profile opens up new possibilities for manufacturers catering to customer demand for higher performance in more compact, silent, vibration free, dustproof, and waterresistant devices.
Would you like to delve deeper into the topic?
At embedded world Exhibition&Conference 2025 from March 11 to 13, 2025,
you will have the opportunity to exchange ideas with industry experts.
Trimension NCJ29D6: Ultra-Wideband IC
Exhibitor: NXP Semiconductors
Hall/Booth: 4A-222
The growing number of applications and technologies in modern cars leads to an increase in cost, weight and complexity. Due to the combined Ultra-wideband (UWB) ranging and radar capabilities of Trimension NCJ29D6 and its multi-application support it has the potential to save up to 100$ BoM per car to reduce cost and weight which is critical to increase energy efficiency of vehicles.
The NCJ29D6 UWB IC is the worldwide first single-chip solution to combine UWB ranging and radar capabilities to allow Automotive OEMs to leverage the UWB architecture in the vehicle for multiple applications such as
- Smart car access / Digital Key
- Child presence detection
- Kick-sensing
- Seatbelt reminder
- Intruder alert
Furthermore for both radar and ranging, NCJ29D6 shows class-leading performance via integrated features such as the radar sensitivity boost and its TRX dual-antenna interface. In terms of security the NCJ29D6 targets highest standards such as ISO21434 and SESIP as well as secure ranging support according to IEEE 802.15.4z to prevent relay attacks to steal cars.
Trimension NCJ29D6 is the first monolithic UWB chipset that combines secure ranging and short-range radar to enable multiple use cases. These are enabled by software, with no changes required on hardware level. No other competitor is yet in series production with a similar product.
MSPM0C1104 Arm® Cortex®-M0+ MCU
Exhibitor: Texas Instruments
Hall/Booth: 3A-131
Texas Instruments will be displaying the device in Hall 3A, booth 131.
